US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Physical vapor deposition system and methods of operating the same" (Taiwanese Inventors)

Posted On: 2026-09-30

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,492, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Physical vapor deposition system ... Read More

US Patent Issued to DAEGU GYEONGBUK INSTITUTE OF SCIENCE AND TECHNOLOGY on Sept. 29 for "Magnetron sputtering apparatus" (South Korean Inventors)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,493, issued on Sept. 29, was assigned to DAEGU GYEONGBUK INSTITUTE OF SCIENCE AND TECHNOLOGY (Daegu, South Korea). "Magnetron sputtering a... Read More

US Patent Issued to SAMSUNG DISPLAY on Sept. 29 for "Mask assembly, method of manufacturing mask assembly, and method and apparatus for manufacturing display device" (South Korean Inventor)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,494, issued on Sept. 29, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-Do, South Korea). "Mask assembly, method of manufacturing mask... Read More

US Patent Issued to INSTITUT POLYTECHNIQUE DE GRENOBLE, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, UNIVERSITE GRENOBLE ALPES on Sept. 29 for "Method for functionalizing a polymer-based substrate by chemical deposition of a thin layer" (French Inventors)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,495, issued on Sept. 29, was assigned to INSTITUT POLYTECHNIQUE DE GRENOBLE (Grenoble, France), CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQU... Read More

US Patent Issued to Tokyo Electron on Sept. 29 for "Film forming method and film forming apparatus" (Japanese, American Inventors)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,496, issued on Sept. 29, was assigned to Tokyo Electron Ltd. (Tokyo). "Film forming method and film forming apparatus" was invented by Kaz... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Substrate processing tube, substrate processing apparatus including the same, and substrate processing method using the apparatus" (South Korean Inventors)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,497, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Substrate processing tube, substrate proce... Read More

US Patent Issued to ASM IP Holding on Sept. 29 for "Method of forming dielectric material layer using plasma" (Japanese Inventors)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,498, issued on Sept. 29, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method of forming dielectric material layer using pla... Read More

US Patent Issued to BENEQ on Sept. 29 for "Atomic layer deposition apparatus" (Finnish Inventor)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,499, issued on Sept. 29, was assigned to BENEQ OY (Espoo, Finland). "Atomic layer deposition apparatus" was invented by Pekka Soininen (Es... Read More

US Patent Issued to ASM IP Holding on Sept. 29 for "Liquid vaporizer" (Arizona Inventor)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,500, issued on Sept. 29, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Liquid vaporizer" was invented by Jereld Lee Winkler ... Read More

US Patent Issued to KOKUSAI ELECTRIC on Sept. 29 for "Substrate processing apparatus, method of manufacturing semiconductor device, method of processing substrate, and recording medium" (Japanese Inventors)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,501, issued on Sept. 29, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Substrate processing apparatus, method of manufacturing semicond... Read More

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US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Physical vapor deposition system and methods of operating the same" (Taiwanese Inventors)

US Patent Issued to DAEGU GYEONGBUK INSTITUTE OF SCIENCE AND TECHNOLOGY on Sept. 29 for "Magnetron sputtering apparatus" (South Korean Inventors)

US Patent Issued to SAMSUNG DISPLAY on Sept. 29 for "Mask assembly, method of manufacturing mask assembly, and method and apparatus for manufacturing display device" (South Korean Inventor)

US Patent Issued to INSTITUT POLYTECHNIQUE DE GRENOBLE, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, UNIVERSITE GRENOBLE ALPES on Sept. 29 for "Method for functionalizing a polymer-based substrate by chemical deposition of a thin layer" (French Inventors)

US Patent Issued to Tokyo Electron on Sept. 29 for "Film forming method and film forming apparatus" (Japanese, American Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Substrate processing tube, substrate processing apparatus including the same, and substrate processing method using the apparatus" (South Korean Inventors)

US Patent Issued to ASM IP Holding on Sept. 29 for "Method of forming dielectric material layer using plasma" (Japanese Inventors)

US Patent Issued to BENEQ on Sept. 29 for "Atomic layer deposition apparatus" (Finnish Inventor)

US Patent Issued to ASM IP Holding on Sept. 29 for "Liquid vaporizer" (Arizona Inventor)

US Patent Issued to KOKUSAI ELECTRIC on Sept. 29 for "Substrate processing apparatus, method of manufacturing semiconductor device, method of processing substrate, and recording medium" (Japanese Inventors)